for baking different flat wafers,
quantity of baking plates: 21 pcs.
size of baking plates: 240 x 240 mm
output depending on execution and kind of wafer:
e.g. crispy and spicy wafers up to 2000 pcs/h
or foam sugar filled wafers and tender wafers up to 600-800 pcs/h
with 21 baking tongs, electrically heated,
dough funnel with automatic dough dosing onto the plates,
synchronised with the movements of the oven, baking time adjustment,
at the end automatic wafer take-off knife (option)
with electronic switchboard,
power consumption: abt. 33 kW, 400 V, 50 Hz,
temperature control and display,
dimensions: 2.4 m diameter, height abt. 1.4 m
net weight: abt. 1300 kg
Several options and baking plate forms possible according to customers requirement.